China's Huawei Technologies and Germany's Infineon Technologies have signed a letter of intent for the purchase of end-to-end semiconductor solutions for wireline and wireless communications, according to a March 19 Dow Jones report. The framework agreement is valued at US$68 million, and Infineon is expected to deliver chip solutions for Huawei during 2009 covering the areas of CO (Central Office) solutions, CPE (Customer Premises Equipment) and mobile phone platforms. The deal is part of the results reached by the Chinese government's recent infrastructure procurement delegation in Europe. According to EE Times, the Chinese delegation has struck US$14 billion worth of procurement deals with German companies in the past few weeks. It is further reported that the Huawei-Infineon deal has moved beyond the phase of mere intent and that Infineon has already began shipments for Huawei